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Plating

Ferrous Sulfamate (40%)

  • Alt Names

    • Iron II amidosulfate
    • Iron II sulfamate

  • Chemical Formula

    Fe(NH2SO3)2･5H2O (soln.)

  • Purity

    40.0%

  • Application

    Plating, Electroforming

Cupric Sulfate*

  • Alt Names

    • Cupric Sulphate
    • Copper Sulfate

  • Chemical Formula

    CuSO4･5H2O

  • Purity

    98.5%

  • Application

    Plating

Cuprous Cyanide*

  • Alt Names

    • Copper Cyanide

  • Chemical Formula

    CuCN

  • Purity

    99.0%

  • Application

    Plating

Sodium Copper Cyanide*

  • Alt Names

    • Sodium tricyaocuprate
    • Disodium tricyanocuprate

  • Chemical Formula

    Na2[Cu(CN)3]･3H2O

  • Purity

    95.0%

  • Application

    Plating

Potassium Copper Cyanide*

  • Alt Names

    • Potassium dicyanocuprate(1-)

  • Chemical Formula

    K2[Cu(CN)3]

  • Purity

    95.0%

  • Application

    Plating

Cupric Pyrophosphate*

  • Alt Names

    • Copper Pyrophosphate
    • Diphosphoric acid, copper salt

  • Chemical Formula

    Cu2P2O7･4H2O

  • Purity

    99.0%

  • Application

    Plating

Cupric Oxide　DC

  • Alt Names

    • Copper Oxide

  • Chemical Formula

    CuO

  • Purity

    Cu: 73.0%

  • Application

    Plating

Stannous Chloride

  • Alt Names

    • Tin dichloride

  • Chemical Formula

    SnCl2･2H2O

  • Purity

    98.0%

  • Application

    Plating, Antistripping agent

Stannous Chloride (45%)

  • Alt Names

    • Tin dichloride
    • Tin protochloride

  • Chemical Formula

    SnCl2･2H2O (soln.)

  • Purity

    45%

  • Application

    Plating, Catalyst raw material

Stannous Pyrophosphate

  • Alt Names

    • Tin II pyrophosphate
    • Tin II diphosphate

  • Chemical Formula

    Sn2P2O7

  • Purity

    97.0%

  • Application

    Plating, Alloy plating

Sodium Stannate

  • Alt Names

    • Disodium tin trioxide

  • Chemical Formula

    Na2SnO3･3H2O

  • Purity

    Sn: 36.0%,40.0%,42.0%

  • Application

    Plating

Potassium Stannate

  • Alt Names

    • Potassium Tin Oxide

  • Chemical Formula

    K2SnO3･3H2O

  • Purity

    Sn:39.0%

  • Application

    Plating

Stannous Oxide

  • Alt Names

    • Tin oxide
    • Tin protoxide

  • Chemical Formula

    SnO

  • Purity

    Sn2+: 86.0%

  • Application

    Pigment, Plating

Nickel Chloride

  • Alt Names

    • Nickel chloride hexahydrate

  • Chemical Formula

    NiCl2･6H2O

  • Purity

    Ni: 24.0%

  • Application

    Plating, Dyestuff

Nickel Ammonium Sulfate

  • Alt Names

    • Ammonium Nickel Sulfate

  • Chemical Formula

    (NH4)2Ni(SO4)2･6H2O

  • Purity

    95.0%

  • Application

    Plating

Potassium Nickel Cyanide

  • Alt Names

    • Dipotassium nickel(II) tetracyanide monohydrate

  • Chemical Formula

    K2[Ni(CN)4]･H2O

  • Purity

    95.0%

  • Application

    Plating

Nickel Carbonate (basic)

  • Alt Names

    • Basic Nickel Carbonate

  • Chemical Formula

    xNiCO3･yNi(OH)2･zH2O

  • Purity

    Ni: 35%,Ni: 44%

  • Application

    Plating, Catalyst raw material

Nickel Sulfamate

  • Alt Names

    • Nickel amidosulfate

  • Chemical Formula

    Ni(NH2SO3)2･4H2O

  • Purity

    96.0%

  • Application

    Plating, Electroforming

Nickel Sulfamate (60%),(65%)

  • Alt Names

    • Nickel amidosulfate

  • Chemical Formula

    Ni(NH2SO3)2･4H2O (soln.)

  • Purity

    60%solution, 65%solution

  • Application

    Plating, Electroforming

Nickel Bromide (50%)

  • Chemical Formula

    NiBr2･6H2O (soln.)

  • Purity

    50.0-51.0%

  • Application

    Plating

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