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Exhibition Period: June 3 - 5, 2015
Venue:East Exhibition Hall, Tokyo Big Sight
East Hall2 2B-11

 

 

<Exhibit products>
supplement of copper ion for non-soluble anode process
 Cupric Oxide DCL
 Nickel Sulfamate Plating agents
Electroless nickel plating process
 NICKEL BOOMER
Etchant agents
 Nickel Selective Etchant-NC
 Nickel Etchant-H
 Copper Selective Etchant-CS series
 Etchant for Chromium
 Alkaline Chromium Etchant
 FLICKER-MH

 Contact(E-mail)
All rights reserved (c)2017 NIHON KAGAKU SANGYO CO.,LTD.
supplement of copper ion for non-soluble anode process Cupric Oxide DCL Nickel Sulfamate Plating agents Electroless nickel plating process  NICKEL BOOMER Etchant agents Nickel Selective Etchant-NC Nickel Etchant-H Copper Selective Etchant-CS series Etchant for Chromium Alkaline Chromium Etchant FLICKER-MH